发明名称 Method of making electronic materials
摘要 The present invention involves fabrication of a hard mask. An embodiment involves the conversion of a precursor into a top-surface imaging layer during a direct patterning step. Another embodiment of the present invention is a method of forming an etched pattern in a substrate. A further embodiment of the present invention is a method of forming an implanted region in a substrate. Preferred precursors are formed from a metal complex comprising at least one ligand selected from the group consisting of acac, carboxylato, alkoxy, azide, carbonyl, nitrato, amine, halide, nitro, and mixtures thereof and at least one metal selected from the group consisting of Li, Al, Si, Ti, V, Cr, Mn, Fe, Ni, Co, Cu, Zn, Sr, Y, Zr, Nb, Mo, Ru, Rh, Pd, Ag, In, Sn, Ba, La, Pr, Sm, Eu, Hf, Ta, W, Re, Os, Ir, Pt, Au, Pb, Th, U, Sb, As, Ce, Mg, and mixtures thereof.
申请公布号 US2002076495(A1) 申请公布日期 2002.06.20
申请号 US20010875115 申请日期 2001.06.06
申请人 MALONEY DAVID J.;LEE WAI M.;ROMAN PAUL J.;FURY MICHAEL A.;HILL ROSS H. 发明人 MALONEY DAVID J.;LEE WAI M.;ROMAN PAUL J.;FURY MICHAEL A.;HILL ROSS H.
分类号 G03F7/004;B05D3/00;B05D5/12;G03F7/32;G03F7/40;H01L21/00;H01L21/027;H01L21/033;H01L21/06;H01L21/266;H01L21/3065;H01L21/308;H01L21/31;H01L21/311;H01L21/314;H01L21/316;H01L21/3205;H01L21/469;H01L21/768;H01L23/52;H01L35/24;(IPC1-7):B05D5/12 主分类号 G03F7/004
代理机构 代理人
主权项
地址