| 摘要 |
PURPOSE: A system for repairing semiconductor devices is provided to improve an accuracy and a speed by using a laser. CONSTITUTION: The repair system comprises an X-rail(1), a lens(5), a Y-rail(2) and a Y-stage(4) used as a chuck. The lens(5) is located on the X-rail(1) to move X-axis direction. The Y-rail(2) guides the Y-axis direction movement and be opposite to the X-rail(1) and the lens(5). A wafer(6) is loaded on the Y-stage(4) located on the Y-rail(2). Since the light lens(5) is mounted on the X-rail(1) instead of heavy X-stage and Y-stage(4), the accuracy of the system is improved.
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