| 摘要 |
PURPOSE: A wafer ring tape removing apparatus is provided to improve the efficiency and to prevent a warpage of a wafer ring by automatically removing the adhesive tape from the wafer ring. CONSTITUTION: A wafer ring tape removing apparatus(100) roughly comprises a wafer cassette loading/unloading section(30), a wafer ring loading/unloading section(40), and an adhesive tape removing section(50). A tape adhered to wafer ring(10) is loaded to a wafer cassette(20) and then supplied using the wafer cassette loading/unloading section(30). Then, the tape adhered to wafer ring(10) is provided to the adhesive tape removing section(50) through the wafer ring loading/unloading section(40). In the adhesive tape removing section(50), an adhesive tape is separated and removed from the wafer ring(10) while the damaged chip remaining on the adhesive tape is grinded, thereby automatically performing a wafer ring tape removing process. |
