| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multi-layered wiring board which can surely connect a lower and an upper wiring layer together by a connecting conductor in a through-hole. SOLUTION: The multi-layered wiring board is manufactured through a process of adhering the lower wiring layer 2 to the top surface of a substrate 1, a process of adhering an insulating layer 4 onto the substrate 1, so that the power wiring layer 2 is coated and forming the through-hole 5 in a spot facing shape having a step part 5a almost parallel to the top surface of the substrate in the insulating layer 4 on the lower wiring layer 2; a process of adhering the upper wiring layer 3 partially led out onto the internal step part 5a in the through-hole 5 to the top surface of the insulating layer 4; and a process for electrically connecting both the wiring layers 2 and 3 to each other through the connection conductor 6, by filling the through-hole 5 with the connection conductor 6 and bringing it into contact with both the top surfaces of the lower wiring layer 2 and upper wiring layer 3 in the through-hole. |
