发明名称 ELASTIC SURFACE WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an elastic surface wave device having a high adhesion strength between a housing resin base and a resin cap. SOLUTION: The elastic surface wave device comprises an elastic surface wave element, lead frame on which the elastic surface wave element is bonded, housing resin base integrally formed with the lead frame, and resin cap which has an attachment region to be in surface contact with an attachment region of the housing resin base and seals the housing with a hollow part being formed inside. The attachment region of at least either the housing resin base or resin cap has a matted surface. By bringing the attachment regions of the housing resin base and resin cap into surface contact by applying an adhesive on the attachment regions, the housing resin base and the resin cap are bonded. The adhesion and affinity between the attachment region having the matted surface and the adhesive can be improved.
申请公布号 JP2002171154(A) 申请公布日期 2002.06.14
申请号 JP20000367229 申请日期 2000.12.01
申请人 TOSHIBA CORP 发明人 MATSUO HIROSHI
分类号 H01L41/09;H01L23/02;H03H9/25;(IPC1-7):H03H9/25 主分类号 H01L41/09
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