PHOTOSENSITIVE POLYMER COMPOSITION, METHOD FOR MANUFACTURING PATTERN AND ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide a heat-resistant photosensitive polymer composition having high sensitivity and excellent pattern form, resolution and storage stability, to provide a method for manufacturing a pattern and to provide electronic parts having high reliability. SOLUTION: The photosensitive polymer composition contains (a) a polyimide precursor or polyimide soluble with an alkali aqueous solution, (b) a compound which produces acid by light and (c) a compound having at least one tertiary alcohol having a hydroxyl group on the carbon atom directly bonded with an aromatic ring, and the composition is used for the method for manufacturing a pattern and for the electronic parts.