| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-device packaging method capable of exactly connecting each of electrodes of semiconductor devices located at a fine pitch and a circuit substrate each other. SOLUTION: The method for manufacturing IC chips 10 used for packaging consists of a process of forming a photoresist film 14 on a portion other than a padding portion 13 of a IC chip 10A, a process of heating/pressing the IC chip 10A onto adhesive conductive-particles 1 after dispersing the adhesive conductive-particles 1 on a plane plate 17, and a process of leaving the adhesive conductive-particles 1 only on the padding portion 13 of the IC chip 10A by removing the adhesive conductive-particles 1 applied to the photoresist 14. |
