| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing apparatus capable of highly precisely polishing the entire surface of a semiconductor wafer to be flat. SOLUTION: A wafer polishing apparatus 10 forms an uneven shape transfer surface 42B on the sucking surface of a backing plate 42, a wafer sucking member, and allows the surface 42B to suck and hold a bottom surface 22A of a wafer 22 to deform a top surface 22B of the wafer 22 into a shape according the shape of the surface 42B. In this state, when the surface 22B of the wafer 22 is pressed on a polishing cloth 16 to be polished, since a polishing pressure is concentrated in the recessed part of the wafer 22 onto which the protruded part of the surface 42B is transferred, the protruded part is polished more than in the case of the recessed part. Accordingly, when a part 23 coated with a thick film is sucked on a position according to the protruded part of the surface 42B, since the part 23C is polished more than the other parts thinly coated with a film, the wafer 22 can be highly precisely polished to be flat. |
