| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method for compactly and densely packaging a plurality of semiconductor chips, and connecting them with the electrically shortest wiring length. SOLUTION: Rewiring 3 for interconnecting a semiconductor chip 1a, a semiconductor chip 1b, and an external connection terminal 4 is formed on the semiconductor chip 1a. An insulating resin 6 having an opening at the formation region of the external connection terminal 7 around the semiconductor chip 1a and at the packaging region of the semiconductor chip 1b at the center of the semiconductor chip 1a is provided on the rewiring 3. The external connection terminal 4 made of BGAs is formed on the opening of the formation region of the external connection terminal 4 via a land 5. The semiconductor chip 1b is subjected to flip-chip connection to the opening of the packaging region of the semiconductor chip 1b via an electrode 11 and a bump 8. The junction surface of the bump 8 is sealed by a sealing resin 7. The semiconductor chip 1b is packaged so that it is flush with the external connection terminal 4. The rear surface is ground so that it becomes lower than the external connection terminal 4 for packaging with high density. |
