发明名称 |
Method for forming a protective package for electronic circuits |
摘要 |
A method for forming by molding a plastic protective package for an electronic integrated circuit that includes an electronic device activated from the outside of said protective package. The method includes: dispensing a covering layer of elastic material on a portion of said electronic device; shaping said covering layer to form a projecting portion from a surface of said electronic device; molding said electronic integrated circuit in said plastic protective package using a mold including at least a half-mold abutting against said projecting portion; and obtaining a hole or a window formed in alignment with said projecting portion in said protective package. |
申请公布号 |
US2002070464(A1) |
申请公布日期 |
2002.06.13 |
申请号 |
US20010997995 |
申请日期 |
2001.11.30 |
申请人 |
STMICROELECTRONICS S.R.I. |
发明人 |
FREZZA GIOVANNI |
分类号 |
H01L21/56;(IPC1-7):H01L23/29 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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