| 摘要 |
The present invention provides a thermal conduction module assembly kit comprising a base being substantially planar in shape and adapted to receive on a top surface a substrate adapted to receive at least one integrated circuit having top and bottom surfaces. A cover is substantially rectangular, having top and bottom surfaces and an outer edge surface. The cover is designed to mate with the substrate such that the integrated circuit is positioned between the bottom surface of the cover and the top surface of the substrate. A removable shim member is planar in shape and has a definable vertical dimension positioned between the bottom surface of the cover and the top surface of the integrated circuit to provide a specified dimension between the top surface of the integrated circuit and the bottom surface of the cover. A positioning member has top, bottom, and inner surfaces, and is substantially circular. The inner surface of the positioning member is positioned to circumscribe and movably mate with the outside surface of the cover. The inner surface of the positioning member is affixable to the outer edge surface of the cover, and the bottom surface of the positioning member is contactable with the top surface of the substrate. The affixable inner surface of the spacer, and the bottom surface of the affixable positioning member, are capable of maintaining the vertical dimension between the bottom surface of the cover and the top surface of the integrated circuit defined by the specified vertical dimension of the shim member, and define a gap of the same specified vertical dimension after the removable shim member is removed. The gap substantially receives a thermally conductive medium.
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