发明名称 HOLDER FOR ELECTROPLATING AND ELECTROPLATING METHOD OF PLATE MOLDED GOODS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electroplating method which facilitates post treatment after electroplating. SOLUTION: The holder 1 for electroplating is integrally formed of an ABS resin and is obtained by perpendicularly providing the rear surface of a flat adhesive plat 2 of a rectangular shape with a flat clamping plate 3 of an approximately rectangular shape at its approximate center in such a manner that this plate can be cut. The base end of the clamping plate 3 is provided with a notch 4 along the surface of the adhesive plate 2. When the molded goods made of a synthetic resin are subjected to electroplating, the surface of the adhesive plate 2 of the holder 1 for electroplating is adhered to the molded goods and after the molded goods are subjected to the electroplating treatment, the clamping plate 3 is cut away.
申请公布号 JP2002167697(A) 申请公布日期 2002.06.11
申请号 JP20000361523 申请日期 2000.11.28
申请人 TAMURA PLASTIC MFG CO LTD;YAMADA:KK 发明人 UCHIYAMA KANJI;SATO SHUJI;KANO TORU
分类号 C25D17/06;(IPC1-7):C25D17/06 主分类号 C25D17/06
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