发明名称 |
HOLDER FOR ELECTROPLATING AND ELECTROPLATING METHOD OF PLATE MOLDED GOODS USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating method which facilitates post treatment after electroplating. SOLUTION: The holder 1 for electroplating is integrally formed of an ABS resin and is obtained by perpendicularly providing the rear surface of a flat adhesive plat 2 of a rectangular shape with a flat clamping plate 3 of an approximately rectangular shape at its approximate center in such a manner that this plate can be cut. The base end of the clamping plate 3 is provided with a notch 4 along the surface of the adhesive plate 2. When the molded goods made of a synthetic resin are subjected to electroplating, the surface of the adhesive plate 2 of the holder 1 for electroplating is adhered to the molded goods and after the molded goods are subjected to the electroplating treatment, the clamping plate 3 is cut away.
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申请公布号 |
JP2002167697(A) |
申请公布日期 |
2002.06.11 |
申请号 |
JP20000361523 |
申请日期 |
2000.11.28 |
申请人 |
TAMURA PLASTIC MFG CO LTD;YAMADA:KK |
发明人 |
UCHIYAMA KANJI;SATO SHUJI;KANO TORU |
分类号 |
C25D17/06;(IPC1-7):C25D17/06 |
主分类号 |
C25D17/06 |
代理机构 |
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地址 |
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