Integrated power electronics cooling housing

摘要

A power electronics cooling housing for use in a power electronics system. The power electronics cooling housing has a body with a coolant cavity formed in one surface and a capacitor bus assembly potting cavity formed in an opposite surface. A bus bar passthrough opening is formed through the body. The bus bar passthrough opening provides an opening from the coolant cavity and the capacitor bus assembly potting cavity. A coolant inlet manifold having a coolant cavity inlet and a coolant outlet manifold having a coolant cavity outlet are formed in the body that are coupled to respective ends of the coolant cavity. An environmental sealing gasket surrounds the coolant cavity.