ELECTRICAL COMPONENT ASSEMBLY AND METHOD OF FABRICATION

摘要

An electrical component assembly and method for the fabrication of the assembly in which particle (318) are affixed to metal contact surfaces (314) and pressure is applied to cause the particles to penetrate into at least one of the metal contact surfaces (314). In one method, hard particles (318) are applied to one of the metal surfaces (314) by electroplating the particles in a plating bath. In another method, the hard particles (318) are applied to a non-conductive adhesive layer (324) positioned between an electronic component (310) and a substrate (312). Once pressure is applied to either the electronic component (310) or the substrate (312), a permanent, electrically conductive bond is formed.