| 摘要 |
A linear semiconductor material having a thin metal-oxide layer and a resist layer is conveyed at a constant speed by rotating rollers. An electron-beam drawing apparatus, in which micro-electron-guns are aligned circumferentially, is disposed between the rollers. The linear semiconductor material passes through a cylindrical hole of the electron-beam drawing apparatus such that a circuit pattern is formed on a surface of the linear semiconductor material by an electron beam. The linear semiconductor material is developed and etched, and divided into predetermined lengths. Thus a linear semiconductor is completed. A semiconductor device is manufactured by bundling a plurality of the linear semiconductors of predetermined length.
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