| 摘要 |
PURPOSE: To provide a method and apparatus for processing a semiconductor pellet, where a tin semiconductor pellet can be picked up without damaging and a processing for enabling a smooth pick up can be carried out in a pick-up step of a semiconductor pellet and thus productivity is improved. CONSTITUTION: A wafer substrate 2 fixed to a wafer ring 1 comprises a base material, a heat shrinkage adhesive, and a radioactive ray curable adhesive. Before supplying the wafer ring 1 in a pellet pick-up part 16, the adhesion of the radioactive ray curable adhesive is weakened by previously irradiating ultra-violet rays on the wafer substrate 2, and then the heat shrinkable adhesive is thermally shrank with a heater 32 and heat treatment is carried out for making an adhesion area with the semiconductor pellet 8 of the radioactive ray curable adhesive small. Then, this wafer ring 2 is supplied in the pellet pick-up part 16 and the semiconductor pellet 8 is picked up by a suction nozzle 21.
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