Laser sintering of materials and a thermal barrier for protecting a substrate

摘要

A laser sintering method and apparatus has a material on a substrate. A laser is used for completely sintering the material and enhancing adhesion of the material to the substrate without damaging the substrate. Any computing device may receive and process data and automatically control the sintering operation. A protective layer may be provided on the substrate. The substrate may be a low temperature substrate and the protective layer may be a protective thermal barrier which prevents damage to the substrate during sintering and also enhances adhesion of the material to the substrate. The substrate, the material, and the protective thermal barrier may be formed as an electronic component. A feedback control system coupled to the computer provides information to the computer for processing and controlling output of the laser. The material on the substrate may have any shape. The substrate may also have any shape. 1 TABLE I Absorbance (in Percent) for Various Materials at Various Wavelengths of Light Laser Type XeCl Excimer Nd:YAG CO2 Wavelength 308 nm 1.06 mum 10.6 mum Metals Silver (Ag) 90% 2-3% 1% Gold (Au) 62% 2-3% 1% Copper (Cu) 75% 10% 2% Platinum (Pt) 60% 20% 4% Palladium (Pd) 58% 26% 4% Metal Oxides Silica (SiC2) 2-90% 2-4% >90% Titania (TiC2) >90% 30% >90% Alumina 85% 1-10% 90% (Al2O3)