Method for manufacturing encapsulated electronic components, particularly integrated circuits

摘要

A method for manufacturing encapsulated electronic components, particularly integrated circuits, is provided. The method includes the steps of: a) attaching electronic components on a first side of an electrically conducting support and electrically connecting the electronic components to the electrically conducting support; b) using a mould to encapsulate the electronic components with an encapsulating material on just the first side of the electrically conducting support, while a second side of the support is substantially completely shielded with the aid of an adhesive film; and c) removing the adhesive film and separating, along cutting lines, the individual encapsulated electronic components, wherein bonding of the adhesive film to a second side to be shielded of the electrically conducting support takes place between step a) and step b).