PIEZOELECTRIC PARTS, PIEZOELECTRIC DEVICE, AND METHOD OF MANUFACTURING THE PARTS

摘要

PROBLEM TO BE SOLVED: To provide piezoelectric parts which have a small size and high accuracy and, at the same time, are high in wiring processability, bondability, and adhesiveness as compared with the conventional piezoelectric parts, a piezoelectric device equipped with the parts, and a method of manufacturing the parts. SOLUTION: The piezoelectric parts 300 have wiring 320 formed on the surface 310a of a piezoelectric element 310. The wiring 320 has an electroless- plated layer 321 formed on the surface 310a of the element 310, and an electroplated layer 322 formed on the upper surface 321a of the layer 321.