| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem where a clean box is manufactured generally by molding reinforced plastics based on specification, dimensional difference due to manufacturing error by molding is present, and troubles like collision is generated in the course of transfer of the clean box on equipment. SOLUTION: This semiconductor wafer treating equipment is provided with a clean box having an aperture, a lid for closing the aperture tightly, a door which comes into contact with the lid and isolates the lid from the clean box, a first stopper which moves together with movement of the clean box without changing the relative position relation to the clean box, and a second stopper which does not move. |
