| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor circuit component, having superior high-frequency characteristics by mounting a semiconductor element on an insulating resin which is not formed with a build-up circuit without using a core board, and to provide a method for manufacturing the same. SOLUTION: The semiconductor circuit component 10 has an input/output terminal 13 on the lower surface, the insulating resin formed with a circuit of wiring patterns 16 and 19 and via conductors 17 and 17a connected to the semiconductor element 2, and a sealing resin 22 for resin-sealing the component. In the component 10, the element 22 is mounted on the resin, formed on a metal plate 11, and after the component has been resin-sealed, the plate 11 is removed by etching, and the component is formed. |
