发明名称 MOLDING SYSTEM WITH MOVABLE MOLD MODULES
摘要 <p>A molding system (10) provides a movable mold module (16) which includes movable tie rods (25) which are extendable and retractable with respect to the movable mold module. The tie rods are movable to be removed from a gap between a fixed platen (18) and a movable platen (22) when the platens are separated. The movable mold module is movable along a base (12) to move the movable platen and tie rods relative to the fixed platen, while the tie rods are further movable relative to the movable mold module. The fixed platen may be rotatable relative to the base to allow booking of the fixed platen for access thereto, and may include two or more platens for simultaneous molding of additional products while one of the platens is booked away from the movable mold module. Two or more molding modules may also be provided around a rotatable platen support which includes multiple platens.</p>
申请公布号 WO2002040196(A2) 申请公布日期 2002.05.23
申请号 US2001048467 申请日期 2001.10.30
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