发明名称 PREPREG, LAMINATE, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To solve the problem that a nonhalogen flame retardant, especially inorganic filler-based flame retardant reduces processability for mechanical processing such as stamping and drilling, required when processing the laminate for electric insulation to provide a printed circuit board, and causes cracks at the processing, whitening caused by delamination, break of a drill, etc. SOLUTION: This prepreg comprises (a) a thermosetting resin and (b) a polymer having a cross-linked structure and a particle shape having <=2μm average particle diameter, and containing at least one kind selected from acrylonitrile, acrylic acid, ethyl acrylate, butyl acrylate, glycidyl acrylate and butadiene as a comonomer, as indispensable components, and is characterized in that the amount of the component (b) is 1-10 pts.wt. based on 100 pts.wt. component (a).
申请公布号 JP2002146061(A) 申请公布日期 2002.05.22
申请号 JP20000343906 申请日期 2000.11.10
申请人 HITACHI CHEM CO LTD 发明人 HIRAI YASUYUKI;TAKEDA YOSHIYUKI;OHORI KENICHI;KAMOSHITA SHINICHI;KAKIYA MINORU;ABE NORIHIRO
分类号 C08J5/24;B32B15/08;B32B15/092;C08K3/00;C08L101/00;H05K1/03;(IPC1-7):C08J5/24 主分类号 C08J5/24
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