发明名称 |
Semiconductor device having X-shaped die support member and method for making the same |
摘要 |
A semiconductor device (10) includes a lead frame (12) having tie bars (16). In one form of the invention, the tie bars are used to support a semiconductor die (20) to alleviate package cracking problems caused by stress and to provide a universal lead frame which is suitable for use with many different die sizes. In another embodiment, a semiconductor device (45) includes a lead frame (40) having a mini-flag (42) to accomplish these same objectives. <IMAGE> |
申请公布号 |
EP0617464(B1) |
申请公布日期 |
2002.05.22 |
申请号 |
EP19940103166 |
申请日期 |
1994.03.03 |
申请人 |
MOTOROLA, INC. |
发明人 |
DJENNAS, FRANK;POKU, ISAAC T.;YAROSH, ROBERT |
分类号 |
H01L23/28;H01L23/495;H01L23/50 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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