| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems of minute ceramic dust being produced from the inner face of a ceramic sealing frame of a package body and the dust inhibiting normal operation of a digital micromirror device, housed in the package to prevent formation of an accurate image. SOLUTION: The package for housing a digital micromirror device consists of the package body 1 and a light-transmitting lid 2. The package body 1 is produced by stacking a ceramic sealing frame 1b surrounding a mount (A) on a ceramic planar insulating substrate 1a, having the mount A where the digital micromirror device 3 is to be mounted in the center part of the upper face of the substrate. The light-transmitting lid 2 is joined to the upper face of the sealing frame 1b. The inner wall face of the sealing frame 1b is wholly coated with a metallized layer 6.
|
