| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for the manufacture of a laminated ceramic electronic component which can reduce rejection rate due to the short circuit or the like of an internal electrode, even if a dielectric layer is made progressively thin and multilayer and which has superior workability and handleability, when it is mounted on various boards or the like. SOLUTION: The manufacturing method is provided with a first lamination process, where a first-face-side sheet block (2a) containing at least one dielectric green sheet layer is laminated on the first face (102a) of a reference sheet block (10a), containing at least one dielectric green sheet layer and the first-face-side sheet block is contact- bonded to the reference sheet block by applying pressure; a second lamination process, where a second-face-side sheet block (2b) containing at least one dielectric green sheet layer is laminated on the second face (102b) on the opposite side of the first face of the reference sheet block to which the first-face-side sheet block is contact- bonded and the second-face-side sheet block is contact-bonded to the reference sheet block by applying a pressure; and a process, where pressure is applied to an unfired laminated raw body obtained, by alternately performing the first lamination process and the second lamination process.
|
