| 摘要 |
PROBLEM TO BE SOLVED: To improve a mounting temperature cycling properties and re- flowability. SOLUTION: A semiconductor device comprises a tape board 2 for supporting a semiconductor chip 1, an insulating adhesive layer 5a disposed between the chip 1 and the board 2, an insulating sheet member 5b disposed by laminating on the layer 5a and formed harder than the layer 5a, a wire 4 for connecting a pad 1a of the chip 1 to a connecting terminal 2c of the board 1, a sealing part 6 formed by resin-sealing the chip 1, and a plurality of solder balls 3 provided on a rear surface 2b of the board 2. In this device, a die bonding layer for fixing the chip 1 is constituted of the layer 5a and the member 5b laminated on the layer 5a. Thus, the die bonding layer is multilayered to be thick to improve a resin balance of front and rear surfaces of the chip 1, to prevent a warpage of a package and to improve the mounting temperature cycling properties and re-flowability. |
