THERMOCOMPRESSION BONDING DEVICE AND BONDING HEAD THEREOF

摘要

The thermocompression-bonding head (10) of the thermocompression-bonding apparatus (1) according to the present invention has a ceramic layer (15) having a predetermined thickness on the contact part (130a) of the pressing member (130) of the head body (13). The difference between the thermal expansion coefficient of the head body (13) and the thermal expansion coefficient of the ceramic layer (15) is within the range of +/- 30 % at a temperature of 400 DEG C or less.