发明名称 INSULATING RESIN FILM-FORMING COMPOSITION AND INSULATING RESIN FILM
摘要 <p>PROBLEM TO BE SOLVED: To obtain a material which solves the conventional technical problems such that high molecular weight polymers are hard to obtain and thus the resulting insulating films have inferior mechanical properties such as tensile strength and further become easily attacked with solvents, and the like, and which can form insulating films having excellent mechanical properties as well as excellent insulating properties. SOLUTION: An insulating resin film-forming composition which is used comprises a polymer of a fluorine-containing polybenzoxazole whose both terminals are capped each with a thermosetting reactive group and cause crosslinking by the curing reaction by heat.</p>
申请公布号 JP2002138248(A) 申请公布日期 2002.05.14
申请号 JP20000334547 申请日期 2000.11.01
申请人 FUJITSU LTD 发明人 NAWARAGE FLORENCE COOLEY
分类号 C09D179/04;C08G73/22;C09D5/25;H01B3/30;H01L23/498;H05K1/00;H05K1/03;H05K3/46;(IPC1-7):C09D179/04 主分类号 C09D179/04
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