| 发明名称 |
Method and apparatus for reducing BGA warpage caused by encapsulation |
| 摘要 |
The present invention provides a ball grid array ("BGA") assembly and process of manufacturing for reducing warpage caused by the encapsulation of the associated semiconductor chip. The assembly and process includes coupling a substrate between a semiconductor chip and a BGA structure; attaching a stabilizing plate to the substrate adjacent the BGA structure; and encapsulating the semiconductor chip.
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| 申请公布号 |
US6387731(B1) |
申请公布日期 |
2002.05.14 |
| 申请号 |
US19990334045 |
申请日期 |
1999.06.15 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
WENSEL RICHARD;GOOCH SCOTT |
| 分类号 |
H01L21/56;H01L23/31;H05K1/02;H05K3/34;(IPC1-7):H01L21/44;H01L21/48;H01L21/50;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/56 |
| 代理机构 |
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