| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a circuit base with no damage on a pattern, high printed film thickness, no difference in the film thickness on printing position and no scattering of a paste, to control quality of printing to be formed and to perform evaluation of material of the paste from the correlation between compression stress/temperature acting on the paste and a shape of printing. SOLUTION: By using a screen printing machine characterized by providing a press plate for filling a conductive paste in an opening part of a screen mask, in a filling process for the conductive paste, by using the press plate by which load/position and temperature can be controlled, the conductive paste is uniformly and simultaneously filled into the opening part of the screen so as to uniform viscosity of the paste. In a plate releasing process, by bringing the press plate into close contact with the screen mask, the plate is uniformly and simultaneously released on the whole face of a printing area without generating deformation of the screen mask.
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