POLYMER/CERAMIC COMPOUND ELECTRONIC SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an organic inorganic compound electronic substrate which can be manufactured at a low cost, a compound electronic substrate wherein relative permitivity, impedance, CTE, double refraction and mutual connection stress are low, and package card reliability is high, a compound electronic substrate wherein Tg is high and thermal stability is superior, and a compound electronic substrate having low hygroscopicity. SOLUTION: A compound electronic and/or optical substrate contains polymer material and ceramic material, and has relative permitivity lower than 4 and coefficient of thermal expansion of 8-14 ppm/ deg.C at 100 deg.C. This compound substrate is composed of polymer material containing ceramic filler material or ceramic material containing polymer filler material.