| 摘要 |
PROBLEM TO BE SOLVED: To obtain low cost and small size electronic equipment having a shield case, no other substrate other than a main substrate, capable of performing multifunction, being manufactured in small size and light weight, and being easily packaged. SOLUTION: An electronic component 25 is soldered by reflow method on an external surface of a shield case 13 for covering an electronic circuit of a main substrate 12 of a cellular phone 11. In other different way, a wiring pattern 24 is printed on an external surface of the shield case 13 and connected to the electronic component 25 by a spring contact 27. The external surface of conductor is covered by a resist 23 and the wiring 24 is printed on the resist 23. The wiring 24 is connected to the electronic component 25. There will be no short circuit between the contact of the electronic component 25 and the shield case 13.
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