| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-polishing head which can independently and easily adjust the pressure value applied to a polishing cloth by a polished surface of a wafer and a pressure value applied to a correction member, pressing the circumferential edge surface of the pressed surface of the polishing cloth by the polished surface of the wafer. SOLUTION: A correction member 26, which presses a polishing cloth 24 pressed by the polished surface of a wafer 46, which is polished by pressing its polished surface against the polishing surface of the polishing cloth 24 with a prescribed pressure, so as to have the circumferential edge surface of the pressed surface of the polishing cloth practically in a same plane as the pressed surface, is provided in a main unit 14 for correction to surround a wafer holding board 18. The wafer-holding board 18 and the correction member 26 are attached to the main unit 14, so as to have the respective pressure values of them applied to the polishing cloth mutually independently adjustable. Furthermore, a swing-proof member 28, which prevents the correction member 26 from swinging relative to the polishing cloth 24 in a horizontal direction, is provided. |
