发明名称 HOT MELT ADHESIVE FILM PARTIALLY COMPRISING AN EVA RESIN
摘要 <p>A hot melt adhesive film, on the surface of which a wax emulsion is deposited, ranging from 20 to 100νm in thickness and comprising 60 to 85 wt% of EVA resin containing 20 to 46 wt% of vinyl acetate, and 15 to 40 wt% of C5 to C9 hydrocarbon resins with a softening temperature of 80 to 130°C. The hot melt adhesive film is advantageous in that equipment for its production is simple, a productivity and a working environment are improved because the wax emulsion layer formed on a surface of the hot melt adhesive film acts as a release agent between films so that it is possible to form, store and use the hot melt adhesive film without a further release agent.</p>
申请公布号 WO2002036703(A1) 申请公布日期 2002.05.10
申请号 KR2001001834 申请日期 2001.10.30
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