SOLDER BUMP FORMING APPARATUS AND METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a solder bump forming apparatus and solder bump forming method which can form effectively stable solder bumps. SOLUTION: The solder bumps are formed by printing solder paste on an electrode of a substrate 16 by using off-contact printing, and solder-bonding solder component on the electrode by reflow. In the case of the off-contact printing, a mask plate 17a is used in which two sides 17e parallel with a printing direction out of four sides of the peripheral parts are free ends which are not restrained. A squeegee 21 is made to abut against an upper surface of the mask plate 17a and slid in the state that the squeegee is pressed against an upper surface of the substrate 16. The solder paste is printed on the substrate 16 via a pattern hole formed in the mask plate 17a. As a result, it is prevented that the squeegee 21 is lifted up in end portions of the substrate 16 by a tensile force of the mask plate 17a, so that the solder paste can be printed with stable printing precision.