| 摘要 |
PROBLEM TO BE SOLVED: To realize compactness, low cost, reduction in external dimensions, improvement in packaging density, and prevention of packaging defects. SOLUTION: An anode conductor layer 21 and a cathode conductor layer 22 are formed in the front surface of a printed wiring board 20, and an anode terminal 23 and a cathode terminal 24 are formed in the rear surface. The anode conductor layer 21 and the anode terminal 23, and the cathode conductor layer 22 and the cathode terminal 24 are connected electrically via through- connection holes 16, 16. A mounting part 28 of a lead frame is electrically connected to the anode conductor layer 21 through resistance welding. An anode lead 2 of a capacitor element 3 is electrically connected to the mounting part 28 by resistance welding, and a cathode layer 4 is connected onto the cathode conductor layer 22 by a conductive adhesive 7. |
