发明名称 Method for determining etch depth
摘要 A method for determining the etch depth of a gate recess (26) in an InP based FET device (10). The source-drain, current-voltage (I-V) relationship is monitored during the etching process. As the etch depth increases, a kink is formed in the linear portion of the I-V relationship. When the kink current reaches a desired value, the etching is stopped. The kink current is a strong function of etch depth, so small differences in etch depth can be easily targeted. By controlling the etch depth, the characteristics of the transistor can be reproducibly controlled and optimized.
申请公布号 US6383826(B1) 申请公布日期 2002.05.07
申请号 US20000691636 申请日期 2000.10.18
申请人 TRW INC. 发明人 BARSKY MICHAEL E.;LAI RICHARD;GRUNDBACHER RONALD W.;DIA ROSIE M.;CHEN YAOCHUNG
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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