| 发明名称 |
Holding unit, processing apparatus and holding method of substrates |
| 摘要 |
A holding unit for holding a substrate to enable a surface of the substrate to be processed. The unit comprises a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.
|
| 申请公布号 |
US2002050322(A1) |
申请公布日期 |
2002.05.02 |
| 申请号 |
US20010984791 |
申请日期 |
2001.10.31 |
| 申请人 |
KUNISAWA JUNJI;KIMURA NORIO;ITO KENYA;FUKUNAGA AKIRA;INOUE YUUKI;TOMITA HIROSHI;NADAHARA SOICHI;SATO MOTOYUKI |
发明人 |
KUNISAWA JUNJI;KIMURA NORIO;ITO KENYA;FUKUNAGA AKIRA;INOUE YUUKI;TOMITA HIROSHI;NADAHARA SOICHI;SATO MOTOYUKI |
| 分类号 |
B25J15/06;H01L21/304;H01L21/306;H01L21/683;(IPC1-7):H01L21/44 |
主分类号 |
B25J15/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
