| 摘要 |
PROBLEM TO BE SOLVED: To detach an electronic component 3 without applying a thermal load such as hot air to a soldering joint 1. SOLUTION: A detaching material 8 contains Sn as a main component and further contains Cu in 0.8%, for example, working distortion is applied by rolling or the like and Sn is transformed into gray tin. The detaching material 8 is mechanically contacted to the soldering joint and kept at a temperature <=transformation point such as <=0 deg.C, for example. Sn contained in a solder 2 self-decays by the tin pest phenomenon by the detaching material 8.
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