Device test handler e.g. for semiconductor packages has indexing mechanism which transports devices from shuttle located at test loading position to testing socket and from socket to shuttle at test unloading position

摘要

A shuttle transfer mechanism moves the shuttles between the device loading/unloading positions and test loading/unloading positions. An indexing mechanism transports the logic device from shuttle located at test loading position to testing a socket in a test chamber (60) and then from testing socket to a shuttle located at test unloading position. A pre-heater preheat the devices before moving the devices into the test chamber. Independent claims are included for the following: (a) Device test handler operating method; (b) Multiple devices testing method.