STRUCTURE OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A structure of a semiconductor package is provided to prevent a wire bonding defect and to improve bonding reliability, by reducing energy dissipation in a wire bonding region of a lead finger in a wire bonding process. CONSTITUTION: A semiconductor chip(7) is attached to the center of the upper surface of a heat sink(4). The lead finger(1) has the wire bonding region(9), disposed near the semiconductor chip. Adhesive(2) is interposed between the lead finger and the heat sink to make the lead finger attached to the heat sink. A wire(6) electrically connects a bonding pad(10) of the semiconductor chip with the wire bonding region of the lead finger. The lower surface of the lead finger except the wire bonding region of the lead finger is half-etched. Adhesive is attached to only the inside of the half-etched region of the lower surface of the lead finger so that the adhesive does not remain between the wire bonding region of the lead finger and the heat sink.