| 摘要 |
PROBLEM TO BE SOLVED: To provide a alignment method of laminated wafers for easily achieving the multiplayer lamination of wafers through accurate alignment. SOLUTION: In this alignment method of laminated wafers, when a recognition mark for alignment is added to each wafer, and at least three wafers are successively laminated while adjacent wafers are being aligned mutually, each wafer is to be laminated, while the position of the recognition mark is shifted successively in the circumferential direction of the wafer. |
