| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device for circuit board with which a cooling speed can be accelerated by incentively cooling the solder part of a circuit board. SOLUTION: An inclined flow straightening plate 25 is provided with respect to a plane flow straightening plate 21 with an angle of 45 deg., and a heat resistant film 26 is provided at the tip of the inclined flow straightening plate 25 so that the tip 26b of the heat resistant film 26 makes contact with a soldering plane 2 of a circuit board 1. A cold wind from an opening 15 is guided upward while being rectified by the plane flow straightening plate 21 and the inclined flow straightening plate 25. Since this cold wind flows between the soldering plane 2 of the circuit board 1 and the heat resistant film 26 as well and hits a solder part 3 of the circuit board while being centralized, the solder part 3 can be exactly cooled, the cooling speed is accelerated and the performance of cooling to the solder part 3 can be improved. The cooling speed can be made higher than 50 deg.C/sec as well, the use of lead-free solder in place of Sn-Pb eutectic solder that is in general use is promoted and the maintenance of the environment maintenance can be improved. |
