发明名称 FLOOR HEATING PANEL
摘要 PROBLEM TO BE SOLVED: To provide a floor heating panel where the so-called burrs or a chip is hard to occur in a base material layer board when the manufacturer forms a groove for arranging the heating pipe of a floor heating panel in that board material layer board, and there is little occurrence of warps as a whole. SOLUTION: In this floor heating panel where floor surface layer plywood 1, a base material layer plate to serve as a layer under that floor surface layer plywood 1, and, in a groove 3 made at the surface of the base material layer plate, a heating pipe 4 are arranged, the base material plate is constituted of a medium specific gravity fiber plate 2, and rear plywood 5 is made at the rear of the medium specific gravity fiber plate 2, and also a solid section 6 is made at the side end face of the medium specific gravity fiber plate 2.
申请公布号 JP2002115855(A) 申请公布日期 2002.04.19
申请号 JP20000310181 申请日期 2000.10.11
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 IMANISHI HIROSHI;OKOCHI NO
分类号 E04F15/18;F24D3/16;(IPC1-7):F24D3/16 主分类号 E04F15/18
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