| 摘要 |
<p>A method of producing a metallised product intended to be used in the manufacturing of a printed wiring board or a printed circuit board, including the step of providing a Printed Circuit Board substrate with a curable dielectric material, a step of curing the dielectric material, a pretreating step comprising immersing the resulting element in a catalyst bath, followed by electroless plating of a first metal layer onto the dielectric material and electroplating of a second metal layer onto the first metal layer, wherein the pretreating step consists of only heat-treating the resulting element and thereafter immediately immersing the hot element in the catalyst bath without any intervening treatment. A metallised product produced according to the method.</p> |
