| 摘要 |
PROBLEM TO BE SOLVED: To prevent the member of a solder bath from being sunk and missing on the bottom of the solder bath when the member is detached, and to prevent equipment from being damaged in an automatic soldering apparatus using a lead-free solder. SOLUTION: In the automatic soldering apparatus 1, the member 3 equipped inside the solder bath 2 of the apparatus is formed of a material having specific gravity smaller than that of the lead-free solder 2a to be used in the solder bath.
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