发明名称 |
METHOD AND APPARATUS FOR FORMING SEMICONDUCTOR THIN FILM |
摘要 |
PROBLEM TO BE SOLVED: To form a semiconductor thin film having excellent homogeneity of each of a film composition structure and a film thickness. SOLUTION: A method for forming a semiconductor thin film comprises the steps of supporting a substrate M having a thin film on a surface by a support 4, providing a gas outlet 12A of a hydrogen radical oppositely to the surface of the thin film of a substrate, supplying the radical H from the outlet 12A to the thin film in a state in which the support 4 is cooled to a temperature condition lower than 40K by a thermal conduction by a refrigerator 3, and forming the thin film on the substrate M. |
申请公布号 |
JP2002110551(A) |
申请公布日期 |
2002.04.12 |
申请号 |
JP20000294738 |
申请日期 |
2000.09.27 |
申请人 |
YAMANASHIKEN SHOKOKAI RENGOKAI |
发明人 |
HIRAOKA KENZO;MIYATA CHIHARU;TAKAMATSU TOSHIYUKI |
分类号 |
H01L21/205;C23C16/452;H01L21/20;H01L21/203;H01L31/04 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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