发明名称 BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a bonding device capable of being made compact, while improving positioning accuracy. SOLUTION: A lateral hole 32, communicating with vertical holes 31, 31 in a drive shaft 22 extending from a servo motor 21, is provided. Upper and lower bearings 33, 34 are provided between through-hole 23 of a holding block 11 and the drive shaft 22, to form a communicating space 35 between both the bearings 33, 34 to communicate with the vacuum joint of the holding block 11. A rotary head 12 is composed of a spline shaft 41 connected to the drive shaft 22 and an outside member 42, and a collet 54 is provided on the outside member 42. A silicon tube 62, connected to the through-hole 52, is connected to the vertical hole 31 of the drive shaft 22. The upper end of the outside member 42 of the rotary head 12 is pressed with the rollers 76, 76 of an arm from VCM.
申请公布号 JP2002110706(A) 申请公布日期 2002.04.12
申请号 JP20000293569 申请日期 2000.09.27
申请人 NIDEC TOSOK CORP 发明人 KOBAYASHI ATSUYUKI;NAKATOMI YOSHIHARU
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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