发明名称 METHOD OF MANUFACTURING MULTILAYERED PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered flexible printed board which can surely protect a cable section from damages and does not constitute any hindrance even when the board is treated with a chemical. SOLUTION: In the method, the multilayered flexible printed board is manufactured in such a way that a copper-plated laminated board is prepared by sticking copper foil to an insulating substrate as the cable section, and the cable section is treated by using the copper foil as a mask. Then the insulating substrate is exposed by removing the copper foil.
申请公布号 JP2002111212(A) 申请公布日期 2002.04.12
申请号 JP20000304576 申请日期 2000.10.04
申请人 NIPPON MEKTRON LTD 发明人 TOYOSHIMA AKIHIKO;ARASE ISAO;AZEYANAGI KUNIHIKO
分类号 H05K3/26;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/26
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