发明名称 |
METHOD OF MANUFACTURING MULTILAYERED PRINTED BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered flexible printed board which can surely protect a cable section from damages and does not constitute any hindrance even when the board is treated with a chemical. SOLUTION: In the method, the multilayered flexible printed board is manufactured in such a way that a copper-plated laminated board is prepared by sticking copper foil to an insulating substrate as the cable section, and the cable section is treated by using the copper foil as a mask. Then the insulating substrate is exposed by removing the copper foil. |
申请公布号 |
JP2002111212(A) |
申请公布日期 |
2002.04.12 |
申请号 |
JP20000304576 |
申请日期 |
2000.10.04 |
申请人 |
NIPPON MEKTRON LTD |
发明人 |
TOYOSHIMA AKIHIKO;ARASE ISAO;AZEYANAGI KUNIHIKO |
分类号 |
H05K3/26;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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